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Improvement in Hard Magnetic Properties of FePt Films by Introduction of Ti Underlayer

机译:引入Ti底层改善FePt薄膜的硬磁性能

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The FePt/Ti double layer films were prepared by dc magnetron sputtering on corning glass substrates with FePt and Ti targets. The Ti underlayer with 100-nm thickness was deposited at substrate temperature 200 ℃, and the FePt magnetic layer, 300 nm, was prepared at temperature from 200℃ to 600 ℃ for direct formation of ordered L1{sub}0 FePt phase on the Ti underlayer. X-ray diffraction analysis showed that the [002] axis of Ti grain was perpendicular to the film plane and the FePt grains had a preferred growth, of (111) plane parallel to the film plane. The degree of ordering of the FePt films increased as Ti underlayer was introduced. Magnetic property measurements indicated that the in-plane coercivities (Hc{sub}||) of the FePt/Ti films in which FePt films was deposited at different temperatures were all higher than that of FePt single layer film without Ti underlayer. When the deposition temperature of FePt film was fixed at 600 ℃, the Hey value of the FePt single layer film was 3.1 kOe, and it increased to 7,3 kOe as 100 nm Ti underlayer was introduced.
机译:FePt / Ti双层薄膜是通过在具有FePt和Ti靶的康宁玻璃基板上进行直流磁控溅射制备的。在200℃的衬底温度下沉积厚度为100 nm的Ti底层,并在200℃至600℃的温度下制备300 nm的FePt磁性层,以在Ti上直接形成有序的L1 {sub} 0 FePt相底层。 X射线衍射分析表明,Ti晶粒的[002]轴垂直于薄膜平面,FePt晶粒具有较好的生长,平行于薄膜平面的(111)平面。 FePt薄膜的有序度随引入Ti底层而增加。磁性能测量表明,其中在不同温度下沉积FePt膜的FePt / Ti膜的面内矫顽力(Hc {sub} ||)均高于没有Ti底层的FePt单层膜的矫顽力。当FePt薄膜的沉积温度固定在600℃时,FePt单层薄膜的Hey值为3.1 kOe,并且随着引入100 nm Ti底层而增加到7.3 kOe。

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