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Coupling-aware high-level interconnect synthesis [IC layout]

机译:耦合感知的高级互连综合[IC布局]

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Ultra-deep submicron technology and system-on-chip have resulted in a considerable portion of power dissipated on buses, in which the major sources of the power dissipation are: 1) the self transition activities on the signal lines and 2) the coupled transition activities of the lines. However, there has been no easy way of optimizing 1 and 2 simultaneously at an early stage of the synthesis process. In this paper, we propose a new (on-chip) bus synthesis algorithm to minimize the total sum of 1 and 2 in the microarchitecture synthesis. Specifically, unlike the previous approaches in which 1 and 2 are minimized sequentially without any interaction between them, or only one of them is minimized, we, given a scheduled dataflow graph to be synthesized, minimize 1 and 2 simultaneously by formulating and solving the two important issues in an integrated fashion: binding data transfers to buses and determining a (physical) order of signal lines in each bus, both of which are the most critical factors that affect the results of 1 and 2. Experimental results on a number of benchmark problems show that the proposed integrated low-power bus synthesis algorithm reduces power consumption by 24.8%, 40.3%, and 18.1% on average over those in (Chang and Pedram 1995, for minimizing 1 only), (Shin and Sakurai 2001, for 2 only) and (Shin and Sakurai 2001 and Chang and Pegram 1995, for 1 and then 2), respectively.
机译:超深亚微米技术和片上系统导致总线上耗散了相当大的功率,其中功耗的主要来源是:1)信号线上的自过渡活动,以及2)耦合的过渡行的活动。但是,在合成过程的早期阶段,还没有简便的方法同时优化1和2。在本文中,我们提出了一种新的(片上)总线综合算法,以最小化微体系结构综合中1和2的总和。具体而言,与之前的方法1和2依次最小化而彼此之间没有任何交互作用,或者仅其中一个被最小化的方法不同,给定要合成的调度数据流图,我们通过公式化和求解两者来同时最小化1和2集成方式中的重要问题:将数据传输绑定到总线并确定每条总线中信号线的(物理)顺序,这都是影响1和2结果的最关键因素。问题表明,与(Chang和Pedram 1995,仅将1最小化),(Shin和Sakurai 2001,针对2)相比,所提出的集成式低功耗总线综合算法平均将功耗降低了24.8%,40.3%和18.1%。分别)和(Shin和Sakurai 2001; Chang和Pegram 1995,分别为1和2)。

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