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Physical-Layer Modeling and System-Level Design of Chip-Scale Photonic Interconnection Networks

机译:芯片级光子互连网络的物理层建模和系统级设计

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摘要

Photonic technology is becoming an increasingly attractive solution to the problems facing today's electronic chip-scale interconnection networks. Recent progress in silicon photonics research has enabled the demonstration of all the necessary optical building blocks for creating extremely high-bandwidth density and energy-efficient links for on-chip and off-chip communications. From the feasibility and architecture perspective however, photonics represents a dramatic paradigm shift from traditional electronic network designs due to fundamental differences in how electronics and photonics function and behave. As a result of these differences, new modeling and analysis methods must be employed in order to properly realize a functional photonic chip-scale interconnect design. In this paper, we present a methodology for characterizing and modeling fundamental photonic building blocks which can subsequently be combined to form full photonic network architectures. We also describe a set of tools which can be utilized to assess the physical-layer and system-level performance properties of a photonic network. The models and tools are integrated in a novel open-source design and simulation environment. We present a case study of two different photonic networks-on-chip to demonstrate how our improved understanding and modeling of the physical-layer details of photonic communications can be used to better understand the system-level performance impact.
机译:光子技术正在成为解决当今电子芯片级互连网络所面临问题的一​​种越来越有吸引力的解决方案。硅光子学研究的最新进展使得能够演示所有必要的光学构件,从而为片上和片外通信创建极高的带宽密度和高能效链路。然而,从可行性和体系结构的角度来看,由于电子学和光子学在功能和行为方式上的根本差异,光子学代表了与传统电子网络设计的巨大范式转变。由于这些差异,必须采用新的建模和分析方法才能正确实现功能性光子芯片级互连设计。在本文中,我们提出了一种表征和建模基本光子构建块的方法,随后可以将它们组合起来以形成完整的光子网络体系结构。我们还描述了一套可用于评估光子网络的物理层和系统级性能的工具。这些模型和工具集成在新颖的开源设计和仿真环境中。我们对两个不同的片上光子网络进行了案例研究,以说明如何利用对光子通信物理层细节的改进理解和建模可以更好地理解系统级性能的影响。

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