机译:3层逻辑对逻辑3-D IC可进一步降低功耗
Synopsys Inc., Mountain View, CA, USA;
Altera Corporation, San Jose, CA, USA;
School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, South Korea;
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA;
Three-dimensional displays; Bonding; Through-silicon vias; Design automation; Metals; Benchmark testing;
机译:保留各向异性扩散的3-D鲁棒细节,以减少3-D牛卵泡超声图像中的斑点
机译:评估基于三维像素的3D功率多普勒超声和颈动脉的3D磁共振血管造影图像。
机译:电力系统无功补偿的新型3-D同心绕线型三相可变电感器
机译:3层,8点快速傅里叶变换3D-IC的线延时减少分析
机译:使用调制功率滤波器和电容器补偿器,可提高电能质量,降低谐波并节省电能/能源。
机译:扩散光学层析成像中基于降维的稀疏3-D图像重建优化算法
机译:表面张力驱动的3-D微光机械结构的自组装