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机译:Spice Compact BJT,MOSFET和JFET型号用于ICS仿真在宽温度范围内(从-200°C到+ 300°C)
Natl Res Univ Higher Sch Econ Moscow Inst Elect & Math Moscow 101000 Russia|Russian Acad Sci Inst Design Problems Microelect Moscow 124365 Russia;
Natl Res Univ Higher Sch Econ Moscow Inst Elect & Math Moscow 101000 Russia|Russian Acad Sci Inst Design Problems Microelect Moscow 124365 Russia;
Natl Res Univ Higher Sch Econ Moscow Inst Elect & Math Moscow 101000 Russia;
Natl Res Univ Higher Sch Econ Moscow Inst Elect & Math Moscow 101000 Russia;
Natl Res Univ Higher Sch Econ Moscow Inst Elect & Math Moscow 101000 Russia;
Chinese Acad Sci Inst Microelect Beijing 100029 Peoples R China;
BJTs/HBTs; compact transistor models; device characteristics measurement; experimental I-V characteristics; junction field-effect transistors (JFETs); low- and high-temperature electronics; model parameter extraction; MOSFETs; SPICE-like circuit simulators;
机译:三栅极无结MOSFET的紧凑模型,可在宽温度范围内进行精确的电路设计
机译:三重栅极连接MOSFET紧凑型造型,用于宽温度范围内精确电路设计
机译:具有300至773 K连续温度可扩展性的SiC BJT紧凑型DC模型
机译:在扩展的温度范围(-200°C至+ 300°C)中进行BiCMOS VLSI仿真的紧凑型器件模型
机译:硅锗HBT在宽温度范围内的物理,紧凑建模和TCAD
机译:对温度和压力的依赖关系是在高温蛋白质展开模拟中常用的一种水模型的一系列特性。
机译:应用混合分析模型逼近宽温度范围内mOsFET的电流 - 电压特性