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首页> 外文期刊>IEEE transactions on circuits and systems . I , Regular papers >MRAM-Enhanced Low Power Reconfigurable Fabric With Multi-Level Variation Tolerance
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MRAM-Enhanced Low Power Reconfigurable Fabric With Multi-Level Variation Tolerance

机译:MRAM增强的低功耗可重新配置结构,具有多级变化公差

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摘要

A hybrid device technology reconfigurable logic fabric is proposed which leverages the cooperating advantages of distinct magnetic random access memory (MRAM)-based look-up tables (LUTs) to realize sequential logic circuits, along with conventional SRAM-based LUTs to realize combinational logic paths. A hierarchical top-down design approach is used to develop a hybrid spin/charge based FPGA (HSC-FPGA) starting from the configurable logic block (CLB) and slice structures down to LUT circuits and the corresponding device fabrication challenges. Circuit-level simulations indicate at least 40 and 83 read and standby power reduction, respectively, for MRAM-LUTs compared to SRAM-LUTs. However, MRAM-LUTs using spin transfer torque (STT) switching approach suffers from significant write energy consumption. Therefore, we have designed spin Hall effect (SHE)-assisted MRAM-LUTs realizing more than 67 and 61 reduction in reconfiguration energy and area consumption, respectively. Fabric-level simulations exhibit that HSC-FPGA achieves 70 and 30 reductions in standby and read power, respectively, compared to SRAM-based FPGAs for various ISCAS-89 and ITC-99 benchmark circuits. Finally, a multi-level method spanning device-sizing, circuit modular-redundancy, and component-level reconfiguration is developed to increase the process variation resiliency of the MRAM-LUTs. The power consumption and area utilization are analyzed to formulate tradeoffs resulting in recommendations toward future multi-device-based reconfigurable fabrics.
机译:提出了一种混合装置技术可重构的逻辑面料,其利用不同磁随机存取存储器(基于MRAM)的查找表(LUT)来实现连续逻辑电路的协作优点,以及传统的基于SRAM的LUT来实现组合逻辑路径。分层自上而下的设计方法用于从可配置的逻辑块(CLB)开始的混合旋转/充电的FPGA(HSC-FPGA),然后将切片结构下降到LUT电路和相应的设备制造挑战。电路级模拟分别表示用于MRAM-LUT的至少40和83读取和待机功率降低,与SRAM-LUT相比。然而,使用旋转转移扭矩(STT)切换方法的MRAM-LUT遭受显着的写入能耗。因此,我们已经设计了旋转霍尔效应(她)分别实现了超过67和61的重新配置和面积消耗来实现超过67和61的MRAM-LUT。与各种ISCAS-89和ITC-99基准电路的SRAM的FPGA相比,织物级模拟分别展示了HSC-FPGA分别在待机和读取功率上降低了70和30次和读取功率。最后,开发了一种多级方法,用于跨越多级方法,电路模块冗余和分量级重新配置以增加MRAM-LUT的过程变化弹性。分析了功耗和区域利用,以制定权衡,导致对未来的基于多设备的可重新配置面料的建议。

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