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Compact Code-Based Signature for Reconfigurable Devices With Side Channel Resilience

机译:基于紧凑的基于代码的可重新配置设备的签名,具有侧通道弹性

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In this paper, we present a compact design for the code based signature called LEDAsig with side channel resistance. Existing implementations concentrate on the high-speed feature while few of them have considerations on area or power efficiency which are particularly decisive for low-cost or power constrained IoT applications. We propose an area-efficient FPGA architecture for systematically rotating the QC-LDGM codes amongst the block RAMs with read-first mode. Additionally, the side channel vulnerability of LEDAsig is carefully examined, and protective masking schemes are introduced accordingly to safeguard our design from power analysis attacks. Effectiveness of these schemes is verified on SAKURA-G FPGA board. Up till now, the design presented in this work is the most compact one and also the first side-channel secure one addressing first-order and (univariate) second-order differential power analysis for the code based signature schemes in the open literature. We show for instance that our first-order (second-order) protected implementation can sign a signature in 117 (203) ms on a Xilinx Spartan-6 FPGA, occupying only 622 (1142) slices, and therefore is a prospective candidate for post-quantum signature schemes in low-resource settings.
机译:在本文中,我们为具有侧通道电阻的代码签名提供了一种紧凑的设计。现有的实现集中在高速特征上,而其中很少有关于面积或功率效率的考虑,这对于低成本或功率受限的物联网应用特别决定性。我们提出了一个区域高效的FPGA架构,用于通过读第一模式系统地旋转块RAM之间的QC-LDGM代码。此外,仔细检查LeDASIG的侧通道漏洞,并因此引入了保护掩蔽方案,以防止我们的设计免受功率分析攻击。在Sakura-G FPGA板上验证了这些方案的有效性。到目前为止,在这项工作中提出的设计是最紧凑的,也是第一侧通道的第一阶和(单变量)二阶差分功率分析,用于开放文献中的代码签名方案。例如,我们展示了我们的一阶(二阶)保护的实现可以在Xilinx Spartan-6 FPGA上签署117(203)MS的签名,仅占622(1142)片,因此是帖子的潜在候选人 - 低资源设置中的符号签名方案。

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