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Hydration effects in the photoassisted wet chemical etching ofgallium nitride

机译:光辅助湿法化学蚀刻氮化镓中的水合作用

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摘要

In this paper, we report a pH dependent study of the wet chemicalnetching of unintentionally doped n-type gallium nitride (GaN) layersngrown on sapphire substrates. When illuminated from a 253.7-nm mercurynline source, etching of GaN is found to take place in aqueous potassiumnhydroxide (KOH) solutions of pH values ranging from 11 to 15. Thenmeasured GaN etch rate reveals a peak value of 90 nm/min at pH=14.25 andndrops rapidly on both sides of the peak position. The etch effect ceasesnin KOH/ethanol solutions of similar molarities. These observations arenattributed to a hydration related phenomenon in which competing effectsnfrom free water molecules (H2O)f and hydroxyl ionsn(OH-) result in a peak etch rate. Our analysis indicates thenslowly falling tail of the GaN etch rate in the dilute pH regime isncharacterized by a (H2O)f dominant process whilenthe fast variation of etch rate at pH>14 is due to a competitionnbetween (H2O)f and OH-. PACS numbers: 68.55.Jk,n73.50.Pz, 81.65.Cf, 81.65.Hq
机译:在本文中,我们报告了蓝宝石衬底上无意掺杂的n型氮化镓(GaN)层湿法化学成网的pH依赖性研究。当从253.7 nm的水银源照射下时,发现GaN的蚀刻发生在pH值为11至15的氢氧化钾水溶液(KOH)中。然后测得的GaN蚀刻速率在pH = 14.25在峰位置的两侧迅速下降。蚀刻作用停止在类似摩尔浓度的KOH /乙醇溶液中。这些观察结果归因于与水合有关的现象,其中自由水分子(H2O)f和羟基离子n(OH-)的竞争效应导致蚀刻速率达到峰值。我们的分析表明,在稀pH值条件下,GaN蚀刻速率的缓慢下降特征是(H2O)f占主导地位,而在pH> 14时蚀刻速率的快速变化是由于(H2O)f和OH-之间的竞争。 PACS编号:68.55.Jk,n73.50.Pz,81.65.Cf,81.65.Hq

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