首页> 外文期刊>IEEE journal of selected topics in quantum electronics >Comparison of Quantum Well Interdiffusion on Group III, Group V, and Combined Groups III and V Sublattices in GaAs-Based Structures
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Comparison of Quantum Well Interdiffusion on Group III, Group V, and Combined Groups III and V Sublattices in GaAs-Based Structures

机译:GaAs基结构中第三,第五,组合第三和第五族子晶格的量子阱相互扩散的比较

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An analytical electron microscope was used for direct measurement of the concentration profiles of $hbox{In}_{1 - x} hbox{Ga}_x hbox{As}_y hbox{P}_{1 - y}$ quantum wells (QWs) and barriers grown by molecular beam epitaxy on GaAs substrates. The well and barrier layers had compositional differences on the group III (In/Ga) sublattice only, the group V (As/P) sublattice only, and on both sublattices. These were annealed over a range of temperatures (700–950 $^circ$C), and the resultant changes in the QW widths and compositional profiles were determined along with the changes in the photoluminescence (PL) emission wavelength. The structures were annealed either uncapped or capped with either a 100-nm-thick layer of low temperature (250 $^circ$ C) grown InGaP (LT-InGaP) or with CVD-grown $hbox{SiO}_{rm 2}$ . The LT-InGaP layer contains excess phosphorus expected to be present as P-antisite defects. This was used to enhance interdiffusion on the group V sublattice during annealing, producing a blue-shift in PL response. The $hbox{SiO}_{rm 2}$ capping leads to outdiffusion of Ga from the top GaAs layer producing additional group III defects that enhance interdiffusion of the group III sublattice. The interdiffusion activation energies and diffusivities were obtained from Arrhenius plots for each of groups III and V QWs profile changes. The compositional profiles of the QW after annealing are used to infer the defects involved in the interdiffusion process on each sublattice.
机译:分析型电子显微镜用于直接测量$ hbox {In} _ {1-x} hbox {Ga} _x hbox {As} _y hbox {P} _ {1-y} $量子阱(QWs)的浓度分布)和通过分子束外延在GaAs衬底上生长的势垒。阱层和势垒层仅在第III族(In / Ga)子晶格,仅在第V族(As / P)子晶格以及两个子晶格上具有成分差异。它们在一定温度范围内(700-950℃)退火,并确定了量子阱宽度和组成分布的变化以及光致发光(PL)发射波长的变化。对结构进行无盖或无盖退火,或者用生长了InGaP(LT-InGaP)的100 nm厚的低温(250°C)低温层或用CVD生长的$ hbox {SiO} _ {rm 2}进行退火。 $。 LT-InGaP层含有过量的磷,预期会以P-反位缺陷存在。这用于增强退火过程中V组亚晶格的相互扩散,从而在PL响应中产生蓝移。 $ hbox {SiO} _ {rm 2} $的封端导致Ga从顶部GaAs层向外扩散,产生了额外的III类缺陷,从而增强了III类亚晶格的相互扩散。对于第III组和第V组的QWs分布变化,均从Arrhenius图获得了相互扩散的活化能和扩散性。退火后的量子阱的成分分布图可用于推断每个子晶格相互扩散过程中涉及的缺陷。

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