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Thermal Analysis: VCSELs on an SiOB

机译:热分析:SiOB上的VCSEL

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摘要

This paper introduces a method combining a general electrothermal network π-model in system level and the associated mathematical technique, Green''s theorem, in terms of the adopted materials and system geometries to build up an equivalent electrothermal circuit model (EETCM) for efficient thermal analysis and behavior prediction in a thermal system. Heat conduction and convection equations in integral forms are derived using the theorem and successfully applied for the thermal analysis of a 3-D optical stack, vertical-cavity surface-emitting lasers (VCSELs) on a silicon optical bench. The complex stack structure in conventional simulators can be greatly simplified using the method by well-predicting probable heat flow paths, and the simplification can eventually achieve the goal of CPU time saving without having complicated mesh designing or scaling. By comparing the data from the measurement, the finite-element simulation, and the method calculation shows that an excellent temperature match within ±∼0.5 °C and 90% CPU time saving can be realized.
机译:本文介绍了一种结合系统级通用电热网络π模型和相关数学技术格林定理的方法,根据所采用的材料和系统几何形状,建立了有效的等效电热电路模型(EETCM)热系统中的热分析和行为预测。使用该定理可以推导出整体形式的热传导和对流方程,并将其成功地应用于硅光学平台上的3D光学堆叠,垂直腔面发射激光器(VCSEL)的热分析。使用该方法,通过很好地预测可能的热流路径,可以大大简化常规模拟器中的复杂堆栈结构,并且简化后可以最终实现节省CPU时间的目标,而无需进行复杂的网格设计或缩放。通过比较测量数据,有限元仿真和方法计算,结果表明,在±〜0.5°C的温度范围内具有出色的温度匹配性能,可节省90%的CPU时间。

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