Open-Access 3-μm SOI Waveguide Platform for Dense Photonic Integrated Circuits

摘要

This paper gives an overview of the 3-mu m silicon-on-insulator (SOI) platform that is openly available from VTT and suitable for the realization of photonic integrated circuits (PICs) for near and mid-infrared applications. Specific benefits of this thick-SOI PIC platform include low optical losses (similar to 0.1 dB/cm), ultradense integration (mu m-scale bends), small polarization dependency (down-to-zero birefringence), and ability to tolerate relatively high optical powers (>1 W). Fabrication technology is based on an i-line stepper and 150-mm wafer size. Open access to the waveguide platform is supported by design kits, wafer-level testing, multi-project wafer runs, dedicated R&D runs, and small-to-medium volume manufacturing.