The Effect of a Metal Plate Barrier with Circular Holes in the Forced Convection of Electronic Equipment

摘要

Two rectangular block-like elements configured as an electronic module are positioned in a parallel-walled channel and cooled by forced convection airflow. A metal plate with circular holes as a barrier protrudes above the plane of the modules, which is intended to function as a cover for protecting them from mechanical or electromagnetic damage, or as a thermal control device. The per-module heat transfer coefficients were measured in the presence of the barrier with various heights, H, and distances, L, between the module and the barrier. In the presence of the barrier with circular holes, the heat transfer coefficient for the two modules was significantly reduced. The corresponding Nusselt numbers are determined as a function of the Reynolds number and the H/L ratio.