Design of a hot air discharge channel for temperature control of the electronic chips on printed circuit boards

摘要

Depending on the increase in speed and performance requirements of electronic devices, the temperature of electronic chips on printed circuit boards increase, which can lead to damage. There are many experimental and numerical studies involving different cooling methods for cooling electronic devices. In this study, discharge of rising hot air from the system with a channel by utilizing pressure difference in airflow was analyzed numerically. At the cases with and without discharge channel, numerical analyses were carried out for different Reynolds numbers (Re), different angles of the circuit boards (alpha), and different ratios of narrowing of the air outlet region (h/W). Numerical results revealed that the use of hot air discharge channel was more effective by the increasing pressure difference in the airflow and placing of the printed circuit boards horizontally, at the conditions that the natural convection predominated. As a result of using hot air discharge channel, the highest average percentage of the temperature drops on the third and fourth heater rows were obtained 11% and 17% for the narrowing ratio of h/W = 0.4. Findings were presented in detail with the graphs involving temperature variations in the electronic chips and pressure drop between the air inlet and outlet zones depending on the different parameter values.