Novel low expansion packages for electronics

摘要

As part of a four-year BRITE/EURAM collaborative project supported by the European Commission, a new family of low-expansion alloys based on aluminium- Silicon has been developed; and the Hirst Division of GEC-Marconi Materials Technology is establishing procedures for fabricating packages for microwave Circuitry in aerospace applications, taking advantage of the low expansivity and Unusually low density of these materials. They are also readily machinable and can be Electroplated with relative ease, in sharp contrast with silicon carbide containing Metal matrix composites and copper-tungsten.