Application of a diffusion bonding methodology to develop a Be/Cu HIP bond suitable for the ITER blanket

摘要

Due to its low atomic mass and high thermal conductivity beryllium is a candidate plasma facing material for the ITER primary first wall (PFW). HIP bonding and brazing have been used previously to bond beryllium tiles to the copper alloy heatsink. However, both methods employ temperature conditions that are incompatible with the otherwise attractive copper alloy, copper chrome zirconium (CuCrZr). This paper outlines the methodology used to develop a HIP bond compatible with CuCrZr and demonstrates its application towards the production of a PFW mock-up.