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Oxygen removal with different cleaning techniques under various wall conditions in HT-7

机译:在HT-7的各种壁面条件下采用不同的清洁技术去除氧气

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The effectiveness of several types of oxygen removal, including baking, ion cyclotron resonant discharge cleaning, glow discharge cleaning and disruptive plasma cleaning were surveyed on hot walls of 402—470 K in the HT-7 machine. Oxygen removal from 'clean' walls and from walls with oxygen contamination has been examined. The wall conditions, such as material, structure of plasma facing components and oxygen retention, would influence the oxygen removal efficiency of ICR cleanings. On 'clean' metal walls before 2000, high power He-ICR produced high oxygen removal. However, on 'clean' walls with carbon limiters after 2004, both He-ICR and D_2-ICR cleanings would induce oxygen retention but not removal. On heavy contaminated walls, such as after oxidation experiment, the removal rate of oxygen during He-ICR cleanings depended on oxygen retained on the walls, ICR power and pressure. Filling helium promoted oxygen removal during baking. He-GDC cleaning possibly has oxygen removal efficiency at far position, but comparison between it and He-ICR cleaning also depended on oxygen retention status. Disruptive plasma discharges with cryo-pumping are essentially for removal of the remained oxygen from the walls after wall cleanings and for re-building normal plasma. To apply those oxygen removal techniques in a superconducting tokamak device, such as EAST and ITER, should depend on oxygen retention and their distribution on walls.
机译:在HT-7机器上,在402-470 K的热壁上调查了多种除氧方法的有效性,包括烘烤,离子回旋共振放电清洁,辉光放电清洁和破坏性等离子体清洁。已经检查了从“干净”的墙壁和带有氧气污染的墙壁中去除氧气的方法。壁的状况,例如材料,面对等离子体的组件的结构以及氧气的保留,会影响ICR清洁的除氧效率。在2000年以前,在“干净”的金属墙壁上,高功率He-ICR产生了很高的除氧率。但是,在2004年之后的带有碳限制器的“清洁”墙壁上,He-ICR和D_2-ICR清洁都会引起氧气滞留,但不会被清除。在重度污染的墙壁上(例如经过氧化实验后),He-ICR清洁过程中氧气的去除率取决于墙壁上保留的氧气,ICR功率和压力。充氦促进了烘烤过程中的除氧。 He-GDC清洁在远处可能具有除氧效率,但与He-ICR清洁之间的比较也取决于氧的保留状态。带有低温泵的破坏性等离子体放电实质上是为了在清洁壁后从壁上除去残留的氧气,并重建正常的等离子体。要在超导托卡马克装置(例如EAST和ITER)中应用这些除氧技术,应取决于除氧量及其在壁上的分布。

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