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Interfacial fracture toughness measurement of welded Babbitt alloy SnSb11Cu6/20Steel

机译:焊接Babbitt合金SNSB11CU6 / 20STEEL的界面断裂韧性测量

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The interface fracture toughness of SnSb11Cu6/20steel was measured by calculating the critical energy release rate and stress phase angle of the interface crack. A three-point bending test was used to introduce cracks into the bonding interface, and the cohesion model of the bonding interface was established through experimental data. Through finite element analysis of load-deflection curves with and without interface crack propagation, the crack initiation point is found. Then the energy calculation model of crack propagation is established, and the critical energy release rate is obtained using the virtual crack growth criterion. The calculation results of the stress phase angle show that the crack propagation is greatly affected by the normal stress after the babbitt alloy layer fractures. If the strength of the substrate material is weaker, the crack will continue to expand in the tangent perpendicular to the crack tip.
机译:通过计算界面裂缝的临界能量释放速率和应力相位角来测量SNSB11CU6 / 20STEEL的界面断裂韧性。 使用三点弯曲试验将裂缝引入粘合界面,通过实验数据建立粘合界面的内聚模型。 通过有限元分析载荷偏转曲线,没有界面裂纹传播,发现了裂缝启动点。 然后建立裂缝传播的能量计算模型,并且使用虚拟裂缝生长标准获得临界能量释放率。 应力相位角的计算结果表明,在巴比特合金层骨折后的正常应力大大影响裂缝繁殖。 如果基材材料的强度较弱,则裂缝将继续在垂直于裂纹尖端的切线中膨胀。

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