Burn-In for High-Power Devices

摘要

The purpose of burn-in with test is to significantly increase the reliability of high-power devices by detecting and eliminating parts that fail early in service. Devices are stimulated by various inputs, including pulsed inputs or built-in self-test (BIST) techniques. Device temperatures typically are held at set points from 100℃ to150℃. The maximum power levels that can be tested are determined by the thermal resistance of the device to its heat sink and of the heat sink to air and the power density of the part: Dynamic burn-in with test also may be used to determine the life span of a device or to weed out devices that fail under marginal conditions. This allows device manufacturers to significantly increase part reliability.