Consumers demand for increased mobility and high functionality with ease of use is driving the need for 3D integration. Sophisticated packaging techniques are required to achieve platforms with reduced footprint and high performance. This increased demand for 3D integrated devices requires more complex and sophisticated packaging techniques and processes. To save money and achieve higher yields requires equipment that combines quality, functionality, flexibility, and control for the process engineers. Yield Engineering Systems' (YES) PB Series automated and manual vacuum cure ovens are specifically designed to address the concerns of process engineers who are now faced with new challenges. One key challenge is the need to use new dielectric materials and create new processes to achieve the desired results.
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