EV Group receives multiple orders for fusion bonder

摘要

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets has announced that it has received multiple orders for its GEMINI FB XT automated fusion wafer bonders from multiple leading device manufacturers. The GEMINI FB XT offers industry leading wafer-to-wafer alignment accuracy, customizable pre- and post-processing configurations with faster handling and improved process flows that increase throughput by up to 50 percent compared to the previous-generation platform, as well as integrated metrology to maximize yields and productivity in high-volume manufacturing (HVM).