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Fabrication of Transimpedance Amplifier Module and Post-Amplifier Module for 40 Gb/s Optical Communication Systems

机译:用于40 Gb / s光通信系统的跨阻放大器模块和后置放大器模块的制造

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摘要

The design and performance of an InGaAs/InP transimpedance amplifier and post amplifier for 40 Gb/s receiver applications are presented. We fabricated the 40 Gb/s transimpedance amplifier and post amplifier using InGaAs/InP heteroj unction bipolar transistor (HBT) technology. The developed InGaAs/InP HBTs show a cutoff frequency (f_T) of 129 GHz and a maximum oscillation frequency (f_(max)) of 175 GHz. The developed transimpedance amplifier provides a bandwidth of 33.5 GHz and a gain of 40.1 dBΩ. A 40 Gb/s data clean eye with 146 mV amplitude of the transimpedance amplifier module is achieved. The fabricated post amplifier demonstrates a very wide bandwidth of 36 GHz and a gain of 20.2 dB. The post-amplifier module was fabricated using a Teflon PCB substrate and shows a good eye opening and an output voltage swing above 520 mV.
机译:介绍了用于40 Gb / s接收器应用的InGaAs / InP跨阻放大器和后置放大器的设计和性能。我们使用InGaAs / InP异质结双极晶体管(HBT)技术制造了40 Gb / s跨阻放大器和后置放大器。已开发的InGaAs / InP HBT的截止频率(f_T)为129 GHz,最大振荡频率(f_(max))为175 GHz。开发的互阻放大器提供33.5 GHz的带宽和40.1dBΩ的增益。跨阻放大器模块的幅度为146 mV的数据眼为40 Gb / s。制成的后置放大器显示出非常宽的36 GHz带宽和20.2 dB的增益。后置放大器模块是使用Teflon PCB基板制造的,具有良好的眼图张开性,输出电压摆幅在520 mV以上。

著录项

  • 来源
    《ETRI journal》 |2009年第6期|749-754|共6页
  • 作者单位

    Convergence Components & Materials Research Laboratory, ETRL Daejeon, Rep. of Korea;

    Convergence Components & Materials Research Laboratory, ETRL Daejeon, Rep. of Korea;

    Convergence Components & Materials Research Laboratory, ETRL Daejeon, Rep. of Korea;

    Convergence Components & Materials Research Laboratory, ETRL Daejeon, Rep. of Korea;

    Convergence Components & Materials Research Laboratory, ETRL Daejeon, Rep. of Korea;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    InGaAs/InP HBT; 40 Gb/s; transimpedance amplifier; post amplifier; module; package;

    机译:InGaAs / InP HBT;40 Gb /秒;跨阻放大器后置放大器模块包;

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