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首页> 外文期刊>IEEE Transactions on Components, Hybrids, and Manufacturing Technology >Contact resistance characteristics of noble metal alloys for connector contacts
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Contact resistance characteristics of noble metal alloys for connector contacts

机译:用于连接器触点的贵金属合金的接触电阻特性

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摘要

Contact resistance characteristics, corrosion characteristics, and the degradation mechanism for several binary and ternary alloys are investigated to evaluate the applicability of lower-cost noble metal alloys to connector contacts. These alloys include Pd, Ag, low-content Au, and Ni. The test connector contacts are clad inlays mated with each other, clad inlays mated with hard gold plating, and clad inlays with hard gold flash mated with inlays of the same material. The atmospheric conditions are air mixed with one or more of the following gases: SO/sub 2/. NO/sub 2/, Cl/sub 2/, or H/sub 2/S. The following alloys, used in inlays of the same alloy that are mated with each other, are listed in order of increasing contact resistance: Au-Ag, Ag-Pd, Au-Ag-Pd, Au-Pd, and Pd-Ni. The contact resistance characteristics of inlays mated with hard gold plating and those of inlays with hard gold flash mated with inlays of the same material are as stable as those of hard gold plating mated with hard gold plating The dominant degradation mechanism affecting the inlay contacts of these alloys is the formation of a corrosion product on the surface area of the contact material. The dominant corrosion products causing an increase in contact resistance are the chlorides in Pd alloys.
机译:研究了几种二元和三元合金的接触电阻特性,腐蚀特性和降解机理,以评估低成本贵金属合金对连接器触点的适用性。这些合金包括Pd,Ag,低含量的Au和Ni。测试连接器触点为相互配合的复合嵌体,复合硬质镀金的复合嵌体,以及具有相同材料的复合体的硬金闪镀的复合嵌体。大气条件是空气与以下一种或多种气体混合:SO / sub 2 /。 NO / sub 2 /,Cl / sub 2 /或H / sub 2 / S。按照增加的接触电阻的顺序列出了以下合金,它们用于同一合金的嵌体中,它们相互配合,依次递增:Au-Ag,Ag-Pd,Au-Ag-Pd,Au-Pd和Pd-Ni。配以硬质金镀层的嵌体和配以相同材料的嵌体的硬金闪镀层的接触电阻特性与配以硬质金镀层的硬质金镀层的接触电阻一样稳定。影响这些嵌体接触的主要降解机理合金是在接触材料的表面上形成腐蚀产物。导致接触电阻增加的主要腐蚀产物是Pd合金中的氯化物。

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