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首页> 外文期刊>IEE Proceedings. Part E >Modelling and analysis of bridging faults in emitter-coupled logic (ECL) circuits
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Modelling and analysis of bridging faults in emitter-coupled logic (ECL) circuits

机译:发射极耦合逻辑(ECL)电路中桥接故障的建模和分析

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摘要

With the recent achievement of lower power and higher densities, bipolar ECL technology is expected to be used widely in high performance digital circuits. Recent investigations have revealed that bridging faults can be a major failure mode in ICs. The paper presents a detailed analysis of bridging faults in ECL. Certain bridging faults manifest as stuck-at faults. Effects of bridging faults between logical units without feedback and logical units with feedback in ECL are presented. An analytical approach is presented for computation of logic levels at ECL outputs under varying unknown bridging resistances. Effects of bridging faults and bridging resistances on output logic levels in ECL have been examined along with their effects on noise immunity.
机译:随着最近实现的低功率和高密度的发展,双极ECL技术有望在高性能数字电路中得到广泛使用。最近的调查表明,桥接故障可能是IC中的主要故障模式。本文对ECL中的桥接故障进行了详细分析。某些桥接故障表现为固定故障。提出了在ECL中没有反馈的逻辑单元和有反馈的逻辑单元之间桥接故障的影响。提出了一种分析方法,用于在未知桥接电阻变化的情况下计算ECL输出处的逻辑电平。研究了桥接故障和桥接电阻对ECL中输出逻辑电平的影响,以及它们对抗扰度的影响。

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