机译:电力模块频域热阻抗模型中的两个热路径的建模与相关性
Shanghai Jiao Tong Univ Minist Educ Key Lab Control Power Transmiss & Convers Shanghai 200240 Peoples R China|Shanghai Jiao Tong Univ Dept Elect Engn Shanghai 200240 Peoples R China;
Shanghai Jiao Tong Univ Minist Educ Key Lab Control Power Transmiss & Convers Shanghai 200240 Peoples R China|Shanghai Jiao Tong Univ Dept Elect Engn Shanghai 200240 Peoples R China;
Shanghai Jiao Tong Univ Minist Educ Key Lab Control Power Transmiss & Convers Shanghai 200240 Peoples R China|Shanghai Jiao Tong Univ Dept Elect Engn Shanghai 200240 Peoples R China;
Shanghai Jiao Tong Univ Minist Educ Key Lab Control Power Transmiss & Convers Shanghai 200240 Peoples R China|Shanghai Jiao Tong Univ Dept Elect Engn Shanghai 200240 Peoples R China;
Frequency-domain analysis; Semiconductor device modeling; Correlation; Power semiconductor devices; Impedance; Heating systems; Thermal analysis; Characterization; frequency-domain modeling; power electronics; power semiconductor device; thermal modeling;
机译:通过热流信息对IGBT模块进行频域热阻抗的建模与表征
机译:使用瞬态热阻抗测量量化大功率多芯片模块热路径中的裂纹区域
机译:基于3D模型确定IGBT模块的功率晶体管和二极管的自热阻抗
机译:利用具有防并联二极管的多芯片SIC MOSFET模块的光学测量和热阻抗模块的热阻抗测量
机译:道路嵌入式无线电力传输模块的热建模与分析
机译:自制蓝牙温度传感器模块估算机床主轴热网络模型的参数
机译:考虑多层热耦合和不同加热/冷却条件的大功率模块三维热阻模型
机译:安全可负担的裂变发动机(saFE 30)模块电导率测试热模型相关性