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Influence of the SiC/SiO2 SiC MOSFET Interface Traps Distribution on C–V Measurements Evaluated by TCAD Simulations

机译:SiC / SiO2 SiC MOSFET接口陷阱分布对TCAD模拟评估C-V测量的影响

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摘要

The reduction of the trap density at the SiC/SiO2 interface of a SiC metal-oxide-semiconductor field-effect transistor (MOSFET) is still an open issue for development of the next generation. Since TCAD simulations are one of the most powerful tools adopted in the field of power semiconductor devices, in this article, we define the guidelines for the calibration of the TCAD model from the point of view of the interface traps modeling. We have carried out a qualitative analysis of the effect of the SiC/SiO2 interface traps properties on the C-V curve by means of TCAD simulations, to support the interpretation of the experimental C-V curves of a SiC MOSFET. A new approach for the simulation of the C-V curves of a SiC MOSFET is proposed as well. The aim of this article is the analysis of the effect of the SiC/SiO2 interface traps on the C-V curve by means of TCAD simulations.
机译:SiC金属氧化物半导体场效应晶体管(MOSFET)的SiC / SiO2接口的陷阱密度的减小仍然是下一代开放的开放问题。由于TCAD模拟是功率半导体器件领域最强大的工具之一,因此在本文中,我们从接口陷阱建模的角度来定义用于校准TCAD模型的指导。我们通过TCAD模拟进行了对SiC / SiO2接口陷阱特性对C-V曲线的影响的定性分析,以支持SiC MOSFET的实验C-V曲线的解释。提出了一种新方法,用于模拟SiC MOSFET的C-V曲线。本文的目的是通过TCAD仿真分析SiC / SiO2接口陷阱对C-V曲线的影响。

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