A Review of Advanced Thermal Management Solutions and the Implications for Integration in High-Voltage Packages

摘要

A host of high-voltage-capable electronic packaging approaches have emerged in recent years for usage in next-generation power electronics. In this article, the focus is on the challenge of managing the thermal characteristics in these cutting edge packaging options, where power densities are exceeding 25 kW/L. Utilizing wide bandgap semiconductors like SiC and GaN can help reduce the thermal inefficiencies associated with conduction losses by using high-frequency switching topologies, but even so, when considering the demand of high voltage in mobile electrified systems, heat generation is still a primary limiting factor in widespread adoption. Accordingly, the increased power density results in much higher temperatures at the device and package level, which in turn reduces the reliability of such systems, in terms of thermal breakdown or thermomechanical strains within the packages. As a result, the design of cooling systems for these electronics has emerged as a key component to successful implementation, and effective thermal management schemes must be closely integrated with the electronic packaging for maximum benefit. This review looks at various thermal management approaches that have been demonstrated in electronic systems, with a specific emphasis on the challenges and needs for next-generation high-voltage power electronics.