The influence of the PCB design and the process of their manufacturing on the possibility of a defect-free production

摘要

The influence of the design parameters (width of the conductor, thickness of the copper foil and gap between the conductors) of the printed circuit board and the characteristics of the technological process of its production: stages of exposure and etching, on the output of defect-free products is considered. According to the results of the study, analytical dependences were obtained, which make it possible to determine the minimum width of the conductor depending on the thickness of the copper foil and etching factor. There is the model proposed that links the probability of manufacturing a defect-free printed circuit board with the parameters considered. The developed model can be extended with other design parameters and models of technological stages.