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Charge emission induced transient leakage currents of a-Si:H and IGZO TFTs on flexible plastic substrates

机译:电荷发射引起的a-Si:H和IGZO TFT在柔性塑料基板上的瞬态泄漏电流

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摘要

The transient off-state thermal emission leakage currents of hydrogenated amorphous silicon (a-Si) and indium gallium zinc oxide (IGZO) metal oxide thin-film transistors (TFTs) fabricated on flexible plastic substrates have been examined for the first time. The transient leakage currents resulting from the detrapping of charge in the TFT active layer were observed to decay in a 1/t power law behaviour from 2 to 100 ms after switching the TFT test structures off. The results demonstrated a uniform density of states for both types of thin-film devices and an ~1.3× higher transient leakage current for the IGZO TFTs. It was also shown that the observed transient leakage currents result in a shot noise at the input to the data-line charge integration amplifiers that is 20 × larger than predicted by using only the conventional static DC TFT leakage current measurements.
机译:首次检查了在柔性塑料基板上制造的氢化非晶硅(a-Si)和铟镓锌氧化物(IGZO)金属氧化物薄膜晶体管(TFT)的瞬态截止状态热泄漏电流。在关闭TFT测试结构后,观察到由TFT活性层中的电荷释放引起的瞬态泄漏电流以1 / t功率定律从2到100 ms衰减。结果表明,两种类型的薄膜器件的状态密度均匀,IGZO TFT的瞬态泄漏电流高约1.3倍。还表明,观察到的瞬态泄漏电流会导致输入到数据线电荷积分放大器的散粒噪声比仅使用常规静态DC TFT泄漏电流测量所预测的散粒噪声大20倍。

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    《Electronics Letters》 |2014年第2期|105-106|共2页
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