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Concurrent 10.5/25 GHz CMOS power amplifier with harmonics and inter-modulation products suppression

机译:具有谐波和互调产物抑制功能的并发10.5 / 25 GHz CMOS功率放大器

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摘要

A concurrent 10.5/25 GHz power amplifier (PA) is designed and implemented in a 0.18 μm CMOS technology. This PA employs dual-band matching networks that can suppress harmonics, inter-modulation products, and out-of-band signals so as to improve linearity performances. Moreover, the driver stage of the PA utilises a current-reused topology which increases the gain without increase of the power dissipation. The chip size of the PA is 0.95 × 0.91 mm including testing pads, and its power consumption is 150 mW. The PA exhibits a measured gain of 15.2 and 6.8 dB, output of 10.5 and 9 dBm, of 11.4 and 10 dBm and power added efficiency of 9 and 4.8% at 10.5 () and 25 GHz (), respectively. The measured rejection of signals at 4 GHz (–2), 14.5 GHz ( − ) and 21 GHz (2) is 43, 16.5 and 10.8 dB, respectively.
机译:采用0.18μmCMOS技术设计并实现了一个并发的10.5 / 25 GHz功率放大器(PA)。该PA采用双频带匹配网络,可以抑制谐波,互调产物和带外信号,从而改善线性性能。此外,PA的驱动器级利用电流重用的拓扑结构,该拓扑结构可在不增加功耗的情况下增加增益。包括测试垫在内,PA的芯片尺寸为0.95×0.91 mm,功耗为150 mW。在10.5()和25 GHz()时,PA的测量增益分别为15.2和6.8 dB,输出分别为10.5和9 dBm,11.4和10 dBm,功率附加效率分别为9和4.8%。在4 GHz(–2),14.5 GHz(-)和21 GHz(2)处测得的信号抑制分别为43、16.5和10.8 dB。

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  • 来源
    《Electronics Letters》 |2015年第14期|1058-1059|共2页
  • 作者

    Wang Sen; Xiao Chang-Yuan;

  • 作者单位

    National Taipei University of Technology, Taiwan;

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  • 原文格式 PDF
  • 正文语种 eng
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