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32nd annual product of the year awards

机译:年度第32届年度产品奖

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Backplane connector manufacturers continue the battle for speed, density, and crosstalk bragging rights. Why? It's not just a pride thing: designers of datacom, telecom, storage, and wireless systems need to be sure that the components thev choose will perform under current and future requirements. Released in January 2007, the XCede backplane connector platform made the biggest leap forward during the past year, laying claim to industry-best performance in all three of the aformentioned categories. The connector boasts speeds in excess of 20 Gbits/s; is designed with a unique 3-D shield technology that dampens high-frequency resonances to reduce crosstalk by as much as 30 times over previous versions; and the six-pair version offers a density of 82 differential pairs per linear inch—an industry-leading spec until weeks before the year's end.
机译:背板连接器制造商继续争夺速度,密度和串扰吹牛权利。为什么?这不仅仅是骄傲的事情:数据通信,电信,存储和无线系统的设计人员需要确保他们选择的组件能够在当前和将来的要求下运行。 XCede背板连接器平台于2007年1月发布,在过去的一年中取得了最大的飞跃,在上述三个类别中均获得了业界最佳性能的称号。该连接器的速度超过20 Gbit / s;采用独特的3-D屏蔽技术设计,可抑制高频共振,从而将串扰降低至以前版本的30倍;六对版本提供了每线性英寸82个差分对的密度,这是直到年底前几周都处于行业领先的规格。

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