Conductive adhesive dissipates heat

摘要

The EP30BN two-part boron nitride epoxy adhesive provides thermal management for heat-generating components. It is a medium-viscosity epoxy system that suits bonding,rnsealing, ana potting applications. The adhesive optimizes heat dissipa-rntion of aerospace, defense, and microelectronic assemblies with minimal weight penalty. It cures at room temperature or more rapidly at elevated temperatures to a tough, ther-moset, dimensionally stable plastic.