The present invention provides a heat-conductive adhesive composition including a polyurethane resin composition (A), an inorganic filler (B), and a photopolymerization initiator (C), the polyurethane resin composition (A) containing a polyurethane (a) having a (meth)acryloyl group and a polyoxyalkylene backbone, and a polymerizable monomer (b), and the content of the inorganic filler (B) being 250-700 parts by mass with respect to 100 parts by mass of the polyurethane resin composition (A).
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