MOSFET package enables high power dissipation

摘要

The Dual Cool packaging for MOSFETs is a top-side cooling PQFN device that incorporates new packaging technology that enables additional power dissipation through the top of the package. The packaging features an exposed heat slug that delivers a significant reduction in thermal resistance from junction to top of case, resulting in 60% higher power dissipation capability than standard PQFN packaging when a heat sink is mounted.