Printable pastes require no cleanup

摘要

The S3X48-M500 and S3X48-M500C printable no-clean lead-free solder pastes are formulated to resist head-in-pillow defects. The halogen-free pastes wet well on pc boards, including OSP, NiAu, Sn, and HASL (SAC305), and retain flux activation during long reflow processing in peak temperatures of 230° to 250℃.