Silicon-based thermal grease targets bond lines down to 1 mil

摘要

Sarcon SG-26SL silicone-based thermal grease delivers thermal conductivity of 2.6 W/m°K with minimal bleed and evaporation characteristics. The nonflowing consistency of the grease results in grease that suits power converter and high-performance CPU applications with bond lines as small as 1 mil. The low thermal resistance of the grease provides efficient transfer of heat from board-level components to nearby heat sinks.