Constructed with high-performance, low-inductance gold-plated embedded wire on elastomer, the 0.65-pitch SG-BGA-7199BGA socket verifies IC function in a development system with specific temperature. The socket is designed for 0.65-mm-pitch 176-ball BGAs in a 13.5 × 8 × 1.2-mm package size, requires no soldering, and operates at bandwidths to 10 GHz with ≤1-dB insertion loss, with typical contact resistance of 20 mil per I/O.rnOperating temperature range is -35° to 100℃. Current capacity is 2 A per pin, with a 0.15-nH pin self-inductance, 0.025-nH mutual inductance, and 0.01-pF capacitance to ground.
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机译：0.65间距SG-BGA-7199BGA插座采用在弹性体上的高性能，低电感镀金嵌入式电线构造而成，可在特定温度下验证开发系统中的IC功能。该插座设计用于尺寸为13.5×8×1.2 mm的0.65mm间距176球BGA，无需焊接，并且在高达10 GHz的带宽下工作，插入损耗≤1-dB，典型的接触电阻为每个I / O 20密耳。工作温度范围为-35°至100℃。每个引脚的电流容量为2 A，引脚自感为0.15nH，互感为0.025nH，接地电容为0.01pF。
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