Miniaturisation of high voltage, high capacitance multilayer: ceramic capacitors

摘要

The techniques and practicalities of handling and mounting discrete components, as distinct from those for semiconductor wafer processing, means that there is a baseline to size reduction which is rapidly approaching. There have, however, been constant improvements in manufacturing and materials technology over the past few decades allowing for miniaturisation of Multilayer Ceramic Chip Capacitors (MLCCs). Significant they may have been, but none the less not quite to the extent found in semiconductor manufacture. Volume manufacturers have pioneered these developments with the current commercially available pinnacle being the sand grain like 01005 EIA case size - surface mount capacitor only 16 thousandths of an inch by 8 thousandths. One such manufacturer has claimed a further improvement with a metric 0201 size, 0.2mm × 0.1mm or 0.008" × 0.004".