While high-density packages such as flip chip and BGA devices deliver substantial I/O resources, their close dimensions introduce substantial cleaning challenges. These devices may have interconnect pitch dimensions of 100 microns or less, and packaging roadmaps only show this shrinking in the future. These packages must be absolutely free of contamination in order to meet performance and dependability standards. However, contaminated interconnect areas are accessible only from the periphery, making it difficult to penetrate and solubilize flux residues from the very center of a package.
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