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TI rolls 3G chip sets for handsets, basestations

机译:TI推出用于手机,基站的3G芯片组

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Manhasset, N.Y. ― With clearly defined performance goals, Texas Instruments Inc. has launched two lines of third-generation UMTS RF and baseband chip sets, one for handsets and one for basestations. TI believes they will halve handset power consumption and double base-station channel density. Emphasizing voice instead of data, TI is coming to a market dominated by Japanese companies such as Matsushita and NEC, as well as Motorola on the U.S. side. However, its ability to leverage advanced processes, integration, power management and RF functionality, along with its already established DSP customers for basestations, may well be the wedge the company needs. So armed, TI aims to provide a more realistic solution to the size and power-consumption woes that have afflicted carriers such as NTT Docomo as they try and draw customers to the more advanced handsets and services.
机译:美国纽约州曼哈塞特市-为了明确定义性能目标,德州仪器公司推出了两套第三代UMTS RF和基带芯片组,一套用于手机,另一套用于基站。德州仪器(TI)相信它们将使手机功耗降低一半,基站信道密度提高两倍。 TI强调语音而不是数据,它进入了由日本公司(例如松下和NEC以及美方的摩托罗拉)主导的市场。但是,其利用先进工艺,集成,电源管理和RF功能的能力,以及其已经为基站建立的DSP客户,很可能是公司所需要的。如此武装起来,TI旨在为困扰NTT Docomo等运营商的尺寸和功耗问题提供更切合实际的解决方案,以吸引客户使用更高级的手机和服务。

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