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Virtual Silicon takes new path to power savings

机译:虚拟芯片公司走节能之路

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摘要

San Mateo, Calif. ― The problem of subthreshold leakage current in advanced CMOS processes is attracting attention as more design teams undertake low-power designs at 130 nm or below. Electrically, the problem is simple: To make the tiny transistors in these geometries fast at the tiny operating voltages they can tolerate, their threshold voltage must be very low. But the lower a MOS transistor's threshold voltage, the larger the source-drain current that flows when the transistor is nominally off. At 180 nm, that was an interesting second-order issue. But at the lower threshold voltages used in 130 nm, subthreshold leakage can contribute a noticeable fraction of a chip's total power consumption.
机译:加利福尼亚州圣马特奥市-随着越来越多的设计团队进行130 nm或以下的低功耗设计,高级CMOS工艺中的亚阈值泄漏电流问题引起了人们的关注。从电气上讲,问题很简单:要使这些几何形状的微型晶体管以它们可以承受的微小工作电压快速运行,它们的阈值电压必须非常低。但是,MOS晶体管的阈值电压越低,名义上处于关断状态时流过的源极-漏极电流就越大。在180 nm处,这是一个有趣的二阶问题。但是,在130 nm处使用较低的阈值电压时,亚阈值泄漏会占芯片总功耗的明显比例。

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