Philips goes small in SiP solutions for wireless LANs, Bluetooth apps

摘要

Eindhoven, Netherlands — Royal Phil-ips Electronics N.V.'s 802.11b low-power wireless local-area network (WLAN) and Bluetooth semiconductor "system-in-package" (SiP) solutions are designed to operate at the same time in small-form-factor systems like smart phones, PDAs and other portables. With SiP, all the components needed to build a complete WLAN or Bluetooth subsystem can be contained in a single semiconductor package, saving signifi- cant space. The BGW200 WLAN SiP needs only three external components and less than half the space of competing solutions. It integrates 15 to 20 components that typically surround a Bluetooth IC.