Expanded Heat Sink Attachment Systems

摘要

Advanced Thermal Solutions, Inc. has added to its line of maxiGRIP™ attachment systems for fast, secure mounting of heat sinks to flip chips, BGAs and other hot PCB components. More than 200 variations of maxiGRIP are now available for use on a wide range of IC brands and packages. The maxiGRIP system features a plastic frame clip that snaps securely around a component's perimeter. A stainless steel spring clip runs though the heat sink's fin field and fastens securely to the plastic frame. As a result, the sink is mounted securely to the component with steady, even pressure. The spring clip is easily removed to allow a heat sink to be detached and re-attached.