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Design and Analysis of Analog Performance of Dual-k Spacer Underlap N/P-FinFET at 12 nm Gate Length

机译:栅长为12 nm时双k间隔下叠N / P-FinFET的模拟性能设计和分析

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摘要

Among the multigate structures, FinFET is emerging as a promising candidate due to its better gate electrostatic control and ease of manufacturability. However, loss of gate electrostatic integrity (EI) is still observed in FinFET while it is scaled down to nano-scale regime, resulting in deterioration of analog performance. Most importantly, precise dimensional requirements and process challenges are major hurdles at nano-scale regime resulting in device-to-device variability. Nevertheless, efficient use of gate sidewall fringing fields, by use of an inner high-k spacer, can restore the loss of gate control. In this paper, we observe that, due to excellent gate EI, the analog performance of dual-k spacer-based underlap N/P-FinFET is better than the conventional low-k N/P-FinFET. Simulation results at 12 nm gate length reveal that dual-k N/P-FinFETs are capable of targeting high-gain, low-power, and moderate frequency of operation even with lower aspect ratio (fin height/fin width) and higher fin width, oxide thickness, and lateral straggle. In addition, the figures of merit of dual-k N/P-FinFETs are less variable to major parametric variations such as fin width and oxide thickness. These attractive features prove to be handy in designing circuitry for low-power battery-operated portable gadgets.
机译:在多栅极结构中,FinFET由于其更好的栅极静电控制和易制造性而成为有前途的候选者。但是,在FinFET中按比例缩小到纳米级时仍会观察到栅极静电完整性(EI)的损失,从而导致模拟性能下降。最重要的是,精确的尺寸要求和工艺挑战是导致器件间可变性的纳米尺度体制的主要障碍。然而,通过使用内部的高k隔离层,有效利用栅极侧壁边缘场可以恢复栅极控制的损失。在本文中,我们观察到,由于出色的栅极EI,基于双k间隔基的重叠N / P-FinFET的模拟性能优于传统的低k N / P-FinFET。栅极长度为12 nm时的仿真结果表明,双k N / P-FinFET能够以高增益,低功率和中等工作频率为目标,即使纵横比(鳍高/鳍宽)较低且鳍宽较高也是如此,氧化物厚度和横向散乱。此外,双k N / P-FinFET的品质因数对主要参数变化(如鳍片宽度和氧化物厚度)的影响较小。这些诱人的功能在设计低功耗电池供电的便携式设备的电路时非常方便。

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