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Accurate Prediction of Device Performance Based on 2-D Carrier Profiles in the Presence of Extensive Mobile Carrier Diffusion

机译:存在大量移动载波扩散时,基于二维载波轮廓的设备性能精确预测

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摘要

In this paper, we illustrate how high-resolution 2-D carrier profiles from scanning spreading resistance microscopy (SSRM) can be used to predict and understand device performance of dynamic random access memory peripheral transistors with high-k metal gate and ultrashallow junctions. In an earlier study on high-speed complementary metal–oxide–semiconductor logic, the 2-D carrier profiles from SSRM were used as the active 2-D dopant profile input to the device simulator as they are virtually identical. The extensive mobile carrier diffusion caused by the lower concentrations, however, implies a strong difference between the mobile carrier distribution and the dopant distribution such that the same approach is no longer valid. Ideally one would have to generate, based on the carrier profiles, the active dopant distribution through the inverse solution of the Poisson equation (in two dimensions) which is, however, numerically nontrivial and often leads to nonunique results. Therefore, an alternative approach is proposed here, whereby we fine-tune the process simulations such that the resulting simulated carrier profiles match the 2-D SSRM profiles. Upon reaching satisfactory agreement, the simulated profiles can be used as input for a device simulator and be used to predict sensitive device parameters such as drain-induced barrier lowering and threshold voltage rolloff.
机译:在本文中,我们说明了如何使用扫描扩展电阻显微镜(SSRM)的高分辨率二维载流子轮廓来预测和了解具有高 的动态随机存取存储器外围晶体管的器件性能。金属门和超浅结。在较早的关于高速互补金属氧化物半导体逻辑的研究中,来自SSRM的2D载流子分布被用作设备模拟器的有源2D掺杂物分布,因为它们实际上是相同的。然而,由较低的浓度引起的广泛的移动载流子扩散意味着移动载流子分布和掺杂剂分布之间的强烈差异,使得相同的方法不再有效。理想情况下,必须根据载流子分布,通过泊松方程(二维)的逆解来生成有源掺杂物分布,然而,这在数值上并不重要,而且常常导致结果不唯一。因此,这里提出了一种替代方法,通过该方法,我们可以微调过程仿真,以使生成的仿真载波轮廓与二维SSRM轮廓相匹配。达成令人满意的协议后,仿真的轮廓可用作设备仿真器的输入,并用于预测敏感的设备参数,例如漏极引起的势垒降低和阈值电压下降。

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