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Study of CCD Transport on CMOS Imaging Technology: Comparison Between SCCD and BCCD, and Ramp Effect on the CTI

机译:基于CMOS成像技术的CCD传输研究:SCCD和BCCD的比较以及对CTI的斜坡效应

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This paper presents measurements performed on charge-coupled device (CCD) structures manufactured on a deep micrometer CMOS imaging technology, in surface channel CCD and in buried channel CCD mode. The charge transfer inefficiency is evaluated for both CCD modes with regard to the injected charge, and the influence of the rising and falling time effect is explored. Controlling the ramp and especially reducing its abruptness allows to get much lower charge transfer inefficiency in buried CCD mode. On the contrary, we did not observe any effect of the ramp on surface channel CCD mode because of the presence of interface traps at the silicon–oxide interface.
机译:本文介绍了在深通道微米CMOS成像技术上制造的电荷耦合器件(CCD)结构,表面通道CCD和掩埋通道CCD模式下进行的测量。针对注入电荷,针对两种CCD模式评估了电荷转移效率,并探讨了上升和下降时间效应的影响。控制斜坡,尤其是降低其突变率,可以使掩埋CCD模式下的电荷转移效率大大降低。相反,由于氧化硅界面处存在界面陷阱,因此我们没有观察到斜坡对表面通道CCD模式的任何影响。

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