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首页> 外文期刊>IEEE Transactions on Electron Devices >Design of High-Performance InAs–Si Heterojunction 2D–2D Tunnel FETs With Lateral and Vertical Tunneling Paths
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Design of High-Performance InAs–Si Heterojunction 2D–2D Tunnel FETs With Lateral and Vertical Tunneling Paths

机译:具有横向和垂直隧穿路径的高性能InAs-Si异质结2D-2D隧道FET设计

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摘要

Double-gate tunneling FETs (TFETs) exploiting the 2D density-of-state switch are studied. A full-band and atomistic quantum transport simulator based on the sp3d5s* tight-binding model is used to solve the quantum transport problem taking into account both lateral and vertical band-to-band tunneling paths. The tunneling paths are identified by means of the calculation of the electron and hole generation rates. They are computed with an in-house tool based on the Flietner imaginary dispersion and a non-local path band-to-band tunneling model. First, a InGaAs electron–hole bilayer TFET is investigated. It is found that the suppression of lateral tunneling components is crucial to obtain a steep slope in this device. On the other hand, the presence of both tunneling components can boost the ON-current of TFETs. The latter can be achieved by implementing an InAs–Si heterostructure as 2D–2D TFET. Such a combination offers a device solution with both steep subthermal subthreshold swing and high ON-current. In the best case of an extremely thin InAs–Si 2D–2D TFET, the minimal swing would be SS = 28 mV/decade and the ON-current would reach 240 μA/μm .
机译:研究了利用2D状态密度开关的双栅隧穿FET(TFET)。基于sp3d5s *紧密绑定模型的全波段和原子的量子传输模拟器用于解决量子传输问题,同时考虑了横向和纵向带间隧道路径。通过计算电子和空穴的产生速率来识别隧道路径。它们是使用内部工具基于Flietner虚散和非局部路径带对带隧道模型进行计算的。首先,研究了InGaAs电子-空穴双层TFET。发现抑制横向隧穿分量对于在该装置中获得陡峭的坡度至关重要。另一方面,两个隧穿组件的存在都会增加TFET的导通电流。后者可以通过将InAs-Si异质结构实现为2D-2D TFET来实现。这种组合提供了具有陡峭的亚温度亚阈值摆幅和高导通电流的器件解决方案。在极薄的InAs–Si 2D–2D TFET的最佳情况下,最小摆幅为SS = 28 mV /十倍,导通电流将达到240μA/μm。

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