首页> 外文期刊>Electron Device Letters, IEEE >Quaternary Barrier InAlGaN HEMTs With $f_{T}/f_{max}$ of 230/300 GHz
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Quaternary Barrier InAlGaN HEMTs With $f_{T}/f_{max}$ of 230/300 GHz

机译:具有 $ f_ {T} / f_ {max} $ 的230/300 GHz四元势垒InAlGaN HEMT

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摘要

Depletion-mode quaternary barrier $hbox{In}_{0.13}hbox{Al}_{0.83}break hbox{Ga}_{0.04}hbox{N}$ high-electron-mobility transistors (HEMTs) with regrown ohmic contacts and T-gates on a SiC substrate have been fabricated. Devices with 40-nm-long footprints show a maximum output current density of 1.8 A/mm, an extrinsic dc transconductance of 770 mS/mm, and cutoff frequencies $f_{T}/f_{max}$ of 230/300 GHz at the same bias, which give a record-high value of $surd f_{T} cdot f_{max} = hbox{263} hbox{GHz}$ among all reported InAl(Ga)N barrier HEMTs. The device speed shows good scalability with gate length despite the onset of short-channel effects due to the lack of a back barrier. An effective electron velocity of $hbox{1.36} times hbox{10}^{7} hbox{cm/s}$, which is comparable with that in the state-of-the-art deeply scaled AlN/GaN HEMTs, has been extracted from the gate-length dependence of $f_{T}$ for gate lengths from 100 to 40 nm.
机译:耗尽型四元势垒$ hbox {In} _ {{0.13} hbox {Al} _ {0.83} break hbox {Ga} _ {0.04} hbox {N} $高电子迁移率晶体管(HEMT),带有再生的欧姆触点和已经在SiC衬底上制造了T型栅。占位面积为40 nm的器件的最大输出电流密度为1.8 A / mm,外部直流跨导为770 mS / mm,截止频率$ f_ {T} / f_ {max} $在230/300 GHz相同的偏差,在所有已报告的InAl(Ga)N势垒HEMT中,surd f_ {T} cdot f_ {max} = hbox {263} hbox {GHz} $的历史最高值。尽管由于缺乏后壁障而引起短沟道效应,但器件速度仍显示出良好的可扩展性,具有栅极长度。有效电子速度为$ hbox {1.36}乘以hbox {10} ^ {7} hbox {cm / s} $,可与先进的深层AlN / GaN HEMT相比。从100至40 nm的栅极长度从$ f_ {T} $的栅极长度依赖性中提取。

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