Application of the Short-Pulse Propagation Technique for Broadband Characterization of PCB and Other Interconnect Technologies

摘要

A comprehensive overview is given of the strengths, limitations, and applicability of the short-pulse propagation technique (SPP). SPP is shown to be able to extract the broadband characteristics of a wide range of interconnect technologies found in digital computer applications and generate causal predictive models. Examples are given of such applications from on-chip wiring, ceramic and organic chip carrier, cards, boards, to cables, and structures with large inhomogeneities, such as found in differential and microstrip cases, irregularities (such as introduced by roughening of metallization), and various operating conditions, such as variable temperature and humidity. The use of SPP as a virtual test bench is explained and showcased through the analysis of the impact of manufacturing tolerances and via stub length on the electrical characteristics. The diverse versatility of the SPP method is discussed through many examples on practical interconnect structures with special emphasis on printed circuit board wiring.