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首页> 外文期刊>IEEE Transactions on Electron Devices >On-chip characterization of interconnect parameters and time delay in 0.18 /spl mu/m CMOS technology for ULSI circuit applications
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On-chip characterization of interconnect parameters and time delay in 0.18 /spl mu/m CMOS technology for ULSI circuit applications

机译:用于ULSI电路应用的0.18 / spl mu / m CMOS技术中互连参数的片上特性和时间延迟

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摘要

A real time, on-chip characterization technique is presented for extracting the interconnect parameters and for determining the associated time delays for ULSI circuit applications. To demonstrate the method, test chips were fabricated in both 0.25 and 0.18 /spl mu/m CMOS technologies, using state of the art process technologies. Results obtained in these two cases are compared and the changing trends and issues for interconnect parameters in making the transition from the 0.25 /spl mu/m to the 0.18 /spl mu/m technologies are discussed. A completed look-up table in conjunction with a working analytic expression of the time delay enables accurate modeling and optimization of interconnect parameters and time delays for a given specification of chip performance.
机译:提出了一种实时的片上表征技术,用于提取互连参数并确定ULSI电路应用的相关时延。为了演示该方法,使用最先进的工艺技术,以0.25和0.18 / spl mu / m CMOS技术制造了测试芯片。比较了这两种情况下获得的结果,并讨论了从0.25 / spl mu / m过渡到0.18 / spl mu / m技术时互连参数的变化趋势和问题。对于给定的芯片性能规格,完整的查找表与时间延迟的有效解析表达式相结合,可以对互连参数和时间延迟进行准确的建模和优化。

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