A 3-D Near-Field Modeling Approach for Electromagnetic Interference Prediction

摘要

This paper presents, through an illustrative example, a 3-D modeling approach to predict the electromagnetic interference (EMI) between complex electronic devices and interconnections placed in the near-field region. Three different analytic coupling formulations have been investigated along with a 3-D-emission model to evaluate the induced voltages in transmission line (TL) extremities in the case of both matched and mismatched TL configurations. The proposed modeling method is successfully validated by comparison with numerical results using electromagnetic (EM) simulation tools and experimental results using near-field measurement. The obtained EM coupling results are more accurate than other traditional 2-D models.